|Place of Origin:||TAIWAN|
|Minimum Order Quantity:||10|
|Packaging Details:||tray packing|
|Payment Terms:||T/T, Western Union, MoneyGram|
Toshiba’s NAND flash memories (NAND) with an integrated controller provide error correction, wear leveling, bad-block management, and more. Their interface is compliant with JEDEC/UFS Version.2.0, eliminating the need for users to perform NAND-specific control.
This simplifies integration of Flash memory storage into embedded applications. original new
Toshiba’s 3D-based UFS utilizes the company’s cutting-edge 64-layer BiCS FLASH 3D flash technology. 3D-based UFS brings the high-speed read/write performance and low power consumption demanded by mobile applications such as smartphones, tablets, and augmented/virtual reality systems. 3D-based UFS will be available in four capacities: 32GB, 64GB, 128GB and 256GB, all of which are compliant with JEDEC UFS Ver2.1.
Automotive UFS from Toshiba was designed with the increasing storage requirements for sophisticated new automotive applications such as entertainment & information systems and ADAS in mind. Automotive UFS supports an extended operating temperature range of -40°C to +105°C, and a wide capacity range (16GB to 256GB). Realizing much higher performance than Automotive e-MMC, Automotive UFS is suitable for a wide variety of automotive applications typically requiring high-capacity storage, as well as other applications (such as wireless communication) that may need smaller capacities.
|Max Data Rate|
|32 GBytes||THGAF8G8T23BAIL *||2.1||1166||2.7 to 3.6||- (1)||1.70 to 1.95||-25 to 85||11.5x13x0.8||P-WFBGA153-1113-0.50|
|64 GBytes||THGAF8G9T43BAIR *||2.1||1166||2.7 to 3.6||- (1)||1.70 to 1.95||-25 to 85||11.5x13x1.0||P-VFBGA153-1113-0.50|
|128 GBytes||THGAF8T0T43BAIR *||2.1||1166||2.7 to 3.6||- (1)||1.70 to 1.95||-25 to 85||11.5x13x1.0||P-VFBGA153-1113-0.50|
|256 GBytes||THGAF8T1T83BAIR *||2.1||1166||2.7 to 3.6||-(1)||1.70 to 1.95||-25 to 85||11.5x13x1.0||P-VFBGA153-1113-0.50|