TC58CVG2S0HRAIGNew Product Serial Interface NAND Description Capacity (bit) 4G Tech. node (nm) 24 Page size (bit) (4096+128)×8 Block size (bit) (256K+8K)×8 I/O (bit) 1,2,4 Keyword SPI RoHS Compatible Product(s) ...
TC58CVG1S3HRAIG New Product Serial Interface NAND Description Capacity (bit) 2G Tech. node (nm) 24 Page size (bit) (2048+64)×8 Block size (bit) (128K+4K)×8 I/O (bit) 1,2,4 Keyword SPI RoHS Compatible Product(s) ...
TC58CVG0S3HRAIGNew Product Serial Interface NAND Description Capacity (bit) 1G Tech. node (nm) 24 Page size (bit) (2048+64)×8 Block size (bit) (128K+4K)×8 I/O (bit) 1,2,4 Keyword SPI RoHS Compatible Product(s) ...
Part Number eMMC Version Capacity Package THGBMDG5D1LBAIT 5 4GB WFBGA153 THGBMDG5D1LBAIL 5 4GB WFBGA153 THGBMFG6C1LBAIL 5 8GB WFBGA153 THGBMHG6C1LBAIL 5.1(1) 8GB WFBGA153 THGBMHG6C1LBAWL 5.1(1) 8GB WFBGA153 ...
THGBMFG8C4LBAIR is 32GB density of e-MMC Module product housed in 153-ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMFG8C4...
1Gbit SLC
2Gbit SLC
4Gbit SLC
8GB eMMC
16GB eMMC
32GB eMMC
64GB eMMC
128GB eMMC
32GB UFS
64GB UFS
